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DYNAMIC RANDOM ACCESS MEMORY DRAM IS43TR16256BL-125KBLI 4GB 256MX16 1.283V 215MA 1.45V 800MHZ PARALLEL 16-BIT BGA-96 IS43/46TR16256B, IS43/46TR16256BL,IS43/46TR85120B, IS43/46TR85120BLIntegrated Silicon Solution, 512Mx8, 256Mx16 4Gb DDR3 SDRAM FEATURES Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5V High speed data transfer rates with system frequency upto 1066 MHz 8 internal banks for Daha fazla bilgi edinin

IS43/46TR16128B, IS43/46TR16128BL,IS43/46TR82560B, IS43/46TR82560BL 256Mx8, 128Mx16 2Gb DDR3 SDRAM FEATURES Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5V High speed data transfer rates with systemfrequency up to 1066 MHz 8 internal banks for concurrent operation 8n-Bit pre-fetch architecture Programmable CAS Latency Programmable Additive Latency: 0, CL-1,CL-2 Programmable CAS WRITE latency Daha fazla bilgi edinin

TPS54622-EP 17V input, 6A output synchronous step-down conversion switch The TPS54622-EP device adopts a thermally enhanced 3.5mm × 3.5mmVQFN package and is a fully functional 17V, 6A synchronous step-down converter. This device features high efficiency and integrates high-side and low-side MOSFETs. It has been optimized to achieve a compact design. By adopting current-mode control to reduce the number of components and choosing a high switching frequency to shrink the Daha fazla bilgi edinin

EMBEDDED NAND FLASH MEMORY CHIP K3KL9L90CM-MGCT IS MAINLY APPLIED IN HIGH-END MOBILE DEVICES K3KL9L90CM-MGCT The K3KL9L90CM-MGCT is an embedded NAND Flash memory chip from Samsung Electronics' UFS (Universal Flash Storage) series. Designed for high-end mobile devices including smartphones and tablets, this chip delivers fast data transmission and storage capabilities. Compliant with UFS 2.1 standard, it offers superior read/write speeds, reduced power consumption, and compact Daha fazla bilgi edinin

Platinum Resistance Temperature Detector PT1000M213B -M213 Thin Film Platinum Resistance Series PT1000B Product Specifications Model Temperature Range & Accuracy PT100 A -200-420℃/±1℃ PT100 B -200-420℃/±3℃ PT100 2B -200-420℃/±6℃ M213 PT100 A -70-500℃/±0.1℃ M213 PT100 B -70-500℃/±0.15℃ M213 PT1000 A -70-500℃/±0.1℃ M213 PT1000 B -70-500℃/±0.15℃ Product Description Platinum Resistance Temperature Detector PT1000M213B is part of the -M213 Thin Film Platinum Resistance Series Daha fazla bilgi edinin

Programmable Logic Device CPLD FPGA Controller Chip GW1N-UV2LQ144XC6/I5 Product Specifications Attribute Value LUT4 2,304 FF 2,016 SSRAM(bits) 18K BSRAM(bits) 72K BSRAM 4 (bits) 96K PLLs 1 I/O Bank 6[2] GPIO 125 Nuclear power voltage 1.8V/2.5V/3.3V Product Overview The GW1N FPGA of Gowin Semiconductor belongs to the LittleBee family Series 1, offering high performance with rich logical resources. It supports multiple I/O level standards and features embedded block static Daha fazla bilgi edinin

CPLD FPGA 576Kbit Field Programmable Gate Array Programmable Logic Device Chip XC6SLX9-2TQG144C Product Specifications Attribute Value Product Category FPGA - Field Programmable Gate Array RoHS Details Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 102 I/O Supply Voltage - Min 1.14 V Supply Voltage - Max 1.26 V Operating Temperature Range 0°C to +85°C Mounting Style SMD/SMT Package/Case TQFP-144 Daha fazla bilgi edinin

Communication Processor PBGA-780 Package P2041NXE7PNC Dedicated Communication Chip Product Specifications Attribute Value Package Type Flip-chip, wire-bond, or flip-chip BGA Dsp Slices Up to 3,840 Power Consumption 1.5W to 100W Interface Protocols PCI Express, Ethernet, USB, etc. Logic Elements Up to 1,952,000 Design Tools Vivado Design Suite Security Features AES and SHA-256 encryption, secure boot, etc. Manufacturer Xilinx Operating Temperature -40°C to 100°C Application Daha fazla bilgi edinin