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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA
64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

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Détails sur le produit:
Lieu d'origine: Corée
Nom de marque: SAMSUNG
Certification: ROHS
Numéro de modèle: Le code de conduite de l'équipage est le code de conduite du véhicule.
Conditions de paiement et expédition:
Quantité de commande min: 1
Prix: consult
Détails d'emballage: R/R
Délai de livraison: 5 ~ 8 jours
Conditions de paiement: T / T, Western Union
Capacité d'approvisionnement: 10000
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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

description de
Taper: Mémoire flash NAND Standard d'interface: UFS 2,1
Capacité: 64 Go Tension de fonctionnement: 2,5 V - 3,6 V
Taux de transfert de données: Jusqu'à 530 Mo / s (lecture séquentielle), jusqu'à 170 Mo / s (écriture séquentielle) Formulaire d'emballage: BGA
Plage de température de fonctionnement: -25°C à +85°C Pin d'E / S: 400mil BGA
Mettre en évidence:

64GB UFS 2.1 NAND flash memory

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BGA NAND flash memory chip

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UFS 2.1 memory with warranty

EMBEDDED NAND FLASH MEMORY CHIP K3KL9L90CM-MGCT IS MAINLY APPLIED IN HIGH-END MOBILE DEVICES
K3KL9L90CM-MGCT

The K3KL9L90CM-MGCT is an embedded NAND Flash memory chip from Samsung Electronics' UFS (Universal Flash Storage) series. Designed for high-end mobile devices including smartphones and tablets, this chip delivers fast data transmission and storage capabilities. Compliant with UFS 2.1 standard, it offers superior read/write speeds, reduced power consumption, and compact dimensions to meet the demanding storage requirements of modern smart devices.

Technical Specifications
Parameter Value
Type NAND flash memory
Interface standard UFS 2.1
Capacity 64GB
Operating voltage 2.5V - 3.6V
Data transfer rate Up to 530 MB/s (sequential read), up to 170 MB/s (sequential write)
Packaging form BGA
Operating temperature range -25°C to +85°C
I/O pin 400mil BGA
Key Features
  • Superior performance compared to traditional eMMC solutions
  • High-speed data transmission with UFS 2.1 interface supporting full-duplex operation for simultaneous read/write operations
  • Reduced power consumption extends device battery life
  • Compact form factor ideal for space-constrained mobile devices
  • Enhanced stability and reliability through rigorous testing
  • Hardware-level encryption for data security
Applications
  • Smartphones and tablets: Primary internal storage solution offering high-capacity, high-performance storage
  • Automotive systems: Ideal for infotainment systems requiring reliable, high-performance storage
  • Industrial control equipment: Stores critical programs and data in automation systems
  • IoT devices: Supports local data storage requirements for real-time responsiveness
  • Wearable devices: Compact size and low power consumption make it perfect for wearable storage solutions
Product Images

Coordonnées
Shenzhen Filetti Technology Co., LTD

Personne à contacter: Mr. Sun

Téléphone: 18824255380

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