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LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC

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LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC

LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC
LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC

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Detalhes do produto:
Lugar de origem: NC
Marca: NXP
Certificação: rohs
Número do modelo: LPC1788FBD208K
Documento: LPC178X_7X.pdf
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1
Preço: consult with
Detalhes da embalagem: T/R
Tempo de entrega: 5-8 dias
Termos de pagamento: T/T, União Ocidental
Habilidade da fonte: 100.000
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LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC

descrição
Categoria de produto:: MCU Max Speed (megahertz): 120MHz
Largura do ônibus de dados:: bocado 32 Tamanho de memória do programa:: 512 KB
Dados RAM Size:: 96 KB Tensão operacional: 2.4V~3.6V
Número de E/S:: 165

LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC

  • Functional replacement for the LPC23xx and LPC24xx family devices.
  • System:
    • ARM Cortex-M3 processor, running at frequencies of up to 120 MHz. A Memory Protection Unit (MPU) supporting eight regions is included.
    • ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
    • Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, USB, Ethernet, and the General Purpose DMA controller. This interconnect provides communication with no arbitration delays unless two masters attempt to access the same slave at the same time.
    • Split APB bus allows for higher throughput with fewer stalls between the CPU and DMA. A single level of write buffering allows the CPU to continue without waiting for completion of APB writes if the APB was not already busy.
    • Cortex-M3 system tick timer, including an external clock input option.
    • Standard JTAG test/debug interface as well as Serial Wire Debug and Serial Wire Trace Port options.
    • Embedded Trace Macrocell (ETM) module supports real-time trace.
    • Boundary scan for simplified board testing.
    • Non-maskable Interrupt (NMI) input.
Part Number Package Type Leads/Balls Body Dimensions SOT Code
LPC1788FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1788FET208 TFBGA208 plastic thin fine-pitch ball grid array package 208 balls 15 ´ 15 ´ 0.7 mm SOT950-1
LPC1788FET180 TFBGA180 thin fine-pitch ball grid array package 180 balls 12 ´ 12 ´ 0.8 mm SOT570-3
LPC1788FBD144 LQFP144 plastic low profile quad flat package 144 leads 20  20  1.4 mm SOT486-1
LPC1787FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1786FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1785FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1778FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1778FET208 TFBGA208 plastic thin fine-pitch ball grid array package 208 balls 15 ´ 15 ´ 0.7 mm SOT950-1
LPC1778FET180 TFBGA180 thin fine-pitch ball grid array package 180 balls 12 ´ 12 ´ 0.8 mm SOT570-3
LPC1778FBD144 LQFP144 plastic low profile quad flat package 144 leads 20  20  1.4 mm SOT486-1
LPC1777FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1776FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1776FET180 TFBGA180 thin fine-pitch ball grid array package 180 balls 12 ´ 12 ´ 0.8 mm SOT570-3
LPC1774FBD208 LQFP208 plastic low profile quad flat package 208 leads 28  28  1.4 mm SOT459-1
LPC1774FBD144 LQFP144 plastic low profile quad flat package 144 leads 20  20  1.4 mm SOT486-1

LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC 0LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC 1

LPC1788FBD208K 32-bit ARM Cortex-M3 Microcontroller Up To 512 KB Flash And96 KB SRAM USB Device/Host/OTG Ethernet LCD EMC 2

Packaging & Shipping

Standard export packaging available. Customers can choose from cartons, wooden cases, and wooden pallets according to their requirements.

Frequently Asked Questions

How to obtain the price?

We typically provide quotations within 24 hours of receiving your inquiry (excluding weekends and holidays). For urgent pricing requests, please contact us directly.

What is your delivery time?

Small batches typically ship within 7-15 days, while large batch orders may require approximately 30 days depending on order quantity and season.

What are your payment terms?

Factory pricing with 30% deposit and 70% balance payment via T/T before shipment.

What are the shipping options?

Available shipping methods include sea freight, air freight, and express delivery (EMS, UPS, DHL, TNT, FEDEX). Please confirm your preferred method before ordering.

Avaliação Geral

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Todos os comentários

J
Jacques
France Oct 8.2025
Ajuda (1)
La préparation de la commande a été rapide. La livraison a été fait à la date prévue. L'objet a été reçu bien emballer et en bon état. La condition de l'objet annoncé correspond à l'objet reçu. Le prix était réaliste. Je rachèterais de ce vendeur. Merci Beaucoup!
etiqueta:

Microplaqueta do microcontrolador,

Memória flash mcu,

Microcontrolador de MCU

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Pessoa de Contato: Mr. Sun

Telefone: +8618824255380

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