ICM-42688-P 6-axis IMU Motion Tracking Device with 18-bit Resolution in LGA-14 Package

The ICM-42688-P is a 6-axis MotionTracking device that combines a 3-axis gyroscope, and a 3-axis accelerometer in a small 2.5x3x0.91 mm (14-pin LGA) package. It also features a 2K-byte FIFO that can lower the traffic on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. ICM-42688-P, with its 6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system-level integration of discrete devices, guaranteeing optimal motion performance for consumers.

The gyroscope supports eight programmable full-scale range settings from ±15.625dps to ±2000dps, and the accelerometer supports four programmable full-scale range settings from ±2g to ±16g. ICM-42688-P also supports external clock input for highly accurate 31kHz to 50kHz clock, that helps to reduce system level sensitivity error, improve orientation measurement from gyroscope data, reduce ODR sensitivity to temperature and device to device variation.

The device includes industry first 20-bits data format support in FIFO for high-data resolution. This FIFO format encapsulates 19-bits of gyroscope data and 18-bits of accelerometer data for high precision applications. Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device features I3CSM, I2C and SPI serial interfaces, a VDD operating range of 1.71 V to 3.6 V, and a separate VDDIO operating range of 1.71 V to 3.6 V.

The host interface can be configured to support I3CSM slave, I2C slave, or SPI slave modes. The I3CSM interface supports speeds up to 12.5MHz (data rates up to 12.5Mbps in SDR mode, 25Mbps in DDR mode), the I2C interface supports speeds up to 1 MHz, and the SPI interface supports speeds up to 24 MHz.

By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 2.5x3x0.91 mm (14-pin LGA), to provide a very small yet high performance low cost package. The device provides high robustness by supporting 20,000g shock reliability.

Typical Operating Circuit of section 4.2, VDD = 1.8 V, VDDIO = 1.8 V, TA=25°C, unless otherwise noted.

Standard export packaging available. Customers can choose from cartons, wooden cases, and wooden pallets according to their requirements.

1. How to obtain the price?

   We typically provide quotations within 24 hours of receiving your inquiry (excluding weekends and holidays). For urgent pricing requests, please contact us directly.

2. What is your delivery time?

   Small batches typically ship within 7-15 days, while large batch orders may require approximately 30 days depending on order quantity and season.

3. What are your payment terms?

   Factory pricing with 30% deposit and 70% balance payment via T/T before shipment.

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