Product Catalogue:Memory > Dynamic Random Access Memory (DRAM)
Universal packaging :FBGA-200
RoHS:Compliance
Product Catalogue:Memory > Dynamic Random Access Memory (DRAM)
Universal packaging :BGA,FBGA
RoHS:Compliance
Product Catalogue:Memory > Dynamic Random Access Memory (DRAM)
Universal packaging:FBGA-96
RoHS:Compliance
Catalogue of Goods:Memory > Dynamic Random Access Memory (DRAM)
General-purpose packaging:FBGA-96
Installation method:Surface mount installation
Product Catalogue:Memory > Dynamic Random Access Memory (DRAM)
Universal packaging :FBGA-96
RoHS:Compliance
Product Catalogue:Memory > Dynamic Random Access Memory (DRAM)
Universal packaging :BGA
RoHS:Compliance
Product Catalogue:Memory >Dynamic Random Access Memory DRAM
Universal packaging :FBGA-96
RoHS:Compliance
Product Catalogue:Memory > Dynamic Random Access Memory
Universal packaging:FBGA-96
RoHS:Compliance
Interface type:eMMC 5.1
The working voltage:2.7V to 3.6V
Operating temperature:-25℃ to +85℃
Interface type:eMMC 5.1
The working voltage:2.7V to 3.6V
Operating temperature:-40℃ to +85℃
Interface type:eMMC 5.1
The working voltage:2.7V to 3.6V
Operating temperature:-40℃ to +85℃
Type:NAND flash memory
Interface standard:UFS 2.1
Capacity:64GB