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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA
64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

Ampliación de imagen :  64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

Datos del producto:
Lugar de origen: Corea
Nombre de la marca: SAMSUNG
Certificación: ROHS
Número de modelo: K3KL9L90CM-MGCT
Pago y Envío Términos:
Cantidad de orden mínima: 1
Precio: consult
Detalles de empaquetado: T/R
Tiempo de entrega: 5 ~ 8day
Condiciones de pago: T/t, unión occidental
Capacidad de la fuente: 10000
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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

descripción
Tipo: Memoria flash NAND Estándar de la interfaz: UFS 2,1
Capacidad: 64 GB Voltaje de funcionamiento: 2.5V - 3.6V
Tasa de transferencia de datos: Hasta 530 MB/s (lectura secuencial), hasta 170 MB/s (escritura secuencial) Formulario de embalaje: BGA
Rango de temperatura de funcionamiento: -25°C a +85°C Pin de E/S: 400mil BGA
Resaltar:

64GB UFS 2.1 NAND flash memory

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BGA NAND flash memory chip

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UFS 2.1 memory with warranty

EMBEDDED NAND FLASH MEMORY CHIP K3KL9L90CM-MGCT IS MAINLY APPLIED IN HIGH-END MOBILE DEVICES
K3KL9L90CM-MGCT

The K3KL9L90CM-MGCT is an embedded NAND Flash memory chip from Samsung Electronics' UFS (Universal Flash Storage) series. Designed for high-end mobile devices including smartphones and tablets, this chip delivers fast data transmission and storage capabilities. Compliant with UFS 2.1 standard, it offers superior read/write speeds, reduced power consumption, and compact dimensions to meet the demanding storage requirements of modern smart devices.

Technical Specifications
Parameter Value
Type NAND flash memory
Interface standard UFS 2.1
Capacity 64GB
Operating voltage 2.5V - 3.6V
Data transfer rate Up to 530 MB/s (sequential read), up to 170 MB/s (sequential write)
Packaging form BGA
Operating temperature range -25°C to +85°C
I/O pin 400mil BGA
Key Features
  • Superior performance compared to traditional eMMC solutions
  • High-speed data transmission with UFS 2.1 interface supporting full-duplex operation for simultaneous read/write operations
  • Reduced power consumption extends device battery life
  • Compact form factor ideal for space-constrained mobile devices
  • Enhanced stability and reliability through rigorous testing
  • Hardware-level encryption for data security
Applications
  • Smartphones and tablets: Primary internal storage solution offering high-capacity, high-performance storage
  • Automotive systems: Ideal for infotainment systems requiring reliable, high-performance storage
  • Industrial control equipment: Stores critical programs and data in automation systems
  • IoT devices: Supports local data storage requirements for real-time responsiveness
  • Wearable devices: Compact size and low power consumption make it perfect for wearable storage solutions
Product Images

Contacto
Shenzhen Filetti Technology Co., LTD

Persona de Contacto: Mr. Sun

Teléfono: 18824255380

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