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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

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64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA
64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA 64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

Grande immagine :  64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

Dettagli:
Luogo di origine: Corea
Marca: SAMSUNG
Certificazione: ROHS
Numero di modello: K3KL9L90CM-MGCT
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1
Prezzo: consult
Imballaggi particolari: T/R
Tempi di consegna: 5 ~ 8 giorni
Termini di pagamento: T/T, Western Union
Capacità di alimentazione: 10000
Contatto Ora chiacchieri

64GB UFS 2.1 NAND Flash Memory Chip K3KL9L90CM-MGCT BGA

descrizione
Tipo: Memoria flash NAND Standard di interfaccia: UFS 2,1
Capacità: 64 GB Tensione operativa: 2,5 V - 3.6V
Velocità di trasferimento dati: Fino a 530 mb/s (lettura sequenziale), fino a 170 mb/s (scrittura sequenziale) Forma di imballaggio: BGA
Intervallo di temperatura operativo: -25°C a +85°C Pin i/o: 400mil BGA
Evidenziare:

64GB UFS 2.1 NAND flash memory

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BGA NAND flash memory chip

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UFS 2.1 memory with warranty

EMBEDDED NAND FLASH MEMORY CHIP K3KL9L90CM-MGCT IS MAINLY APPLIED IN HIGH-END MOBILE DEVICES
K3KL9L90CM-MGCT

The K3KL9L90CM-MGCT is an embedded NAND Flash memory chip from Samsung Electronics' UFS (Universal Flash Storage) series. Designed for high-end mobile devices including smartphones and tablets, this chip delivers fast data transmission and storage capabilities. Compliant with UFS 2.1 standard, it offers superior read/write speeds, reduced power consumption, and compact dimensions to meet the demanding storage requirements of modern smart devices.

Technical Specifications
Parameter Value
Type NAND flash memory
Interface standard UFS 2.1
Capacity 64GB
Operating voltage 2.5V - 3.6V
Data transfer rate Up to 530 MB/s (sequential read), up to 170 MB/s (sequential write)
Packaging form BGA
Operating temperature range -25°C to +85°C
I/O pin 400mil BGA
Key Features
  • Superior performance compared to traditional eMMC solutions
  • High-speed data transmission with UFS 2.1 interface supporting full-duplex operation for simultaneous read/write operations
  • Reduced power consumption extends device battery life
  • Compact form factor ideal for space-constrained mobile devices
  • Enhanced stability and reliability through rigorous testing
  • Hardware-level encryption for data security
Applications
  • Smartphones and tablets: Primary internal storage solution offering high-capacity, high-performance storage
  • Automotive systems: Ideal for infotainment systems requiring reliable, high-performance storage
  • Industrial control equipment: Stores critical programs and data in automation systems
  • IoT devices: Supports local data storage requirements for real-time responsiveness
  • Wearable devices: Compact size and low power consumption make it perfect for wearable storage solutions
Product Images

Dettagli di contatto
Shenzhen Filetti Technology Co., LTD

Persona di contatto: Mr. Sun

Telefono: 18824255380

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